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The 670IPG-X19-25G-100G is Evertz' third generation low latency, ultra high-density gateway for IP encapsulation/de-encapsulation of SDI over 25GbE, as well as protocol conversion including SMPTE ST 2022-6 and SMPTE ST 2110.
With direct conversion of up to 16x input and 16x output SD/HD/3G signals to/from IP using SMPTE ST 2022-6 or SMPTE ST 2110 formats, 670IPG-X19-25G-100G series delivers unparalleled processing density. The 670IPG-X19-25G-100G series also provides high-density format conversion as the industry transitions to SMPTE ST 2110.
670IPG-X19-25G-100G also provides per-input AVM monitoring, time-stamped Ethernet outputs and audio/video synchronization.
The 670IPG-X19-25G-100G series modules incorporates patent pending multipath, multi-flow packet merge for bit error resilience in networks, to achieve 100% QoS.
The 670IPG-X19-25G-100G can be managed via integrated HTTP web interface, in-band via its 25GbE interface as well as SNMP management via frame controller.
1080p/59.94, 1080p/50, 1080p/29.97, 1080p/25, 1080p/23.98, 1080p/24, 1080i/59.94, 1080i/50, 720p/59.94, 720p/50, 525i/59.94, 625i/50.
For 12G standards, contact factory.
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